PROPINK® Fanfold Underlayment Board
PROPINK® Fanfold Underlayment Board is a thin extruded polystyrene fanfold board faced on both surfaces with a plastic film facer. It is engineered to provide resistance to air infiltration and liquid water penetration in residential and commercial exterior wall construction.
Product Features
Exceptional moisture resistance
Building Enclosure Solutions
Owens Corning® Enclosure Solutions offers one of the largest portfolios of commercial insulation products for walls, roofs, and below-grade foundations. Engineered with Owens Corning technical expertise and supported by Building Science, Owens Corning® Enclosure Solutions deliver buildings that perform without compromising design.
PROPERTY | TEST METHOD | 1/4" PRODUCT | 3/8" PRODUCT | |
R-Value (ft2·hr·F/Btu) | ASTM C518 (Modified) | 1.0 | 1.5 | |
| Water Absorption, maximum % by vol., max | ASTM C272 | 2.0 | 2.0 | |
| Water Vapor Permeance, perms, min | ASTM E96 (Procedure A) | 1.0 | 1.0 | |
| Compressive Strength, psi, min | ASTM D1621 (Modified) | 10 | 10 | |
| Flame Spread | ASTM E84 / UL723 | 10 | 10 | |
| Smoke Development | ASTM E84 / UL 723 | 165 | 200-350 | |
| Maximum Service Temperature, °F | 165 | 165 | ||
